HP PC Mechanical and Thermal Hardware Engineer in Houston, Texas

PC Mechanical and Thermal Hardware Engineer

Description -


Designs, analyzes, develops, modifies and evaluates materials, mechanical systems, equipment and packaging. Conducts feasibility, design margin and validation analysis and empirical testing on new and modified designs. Leads and/or assists in architecture development and assessment. Evaluates reliability of materials, properties, designs, and techniques used in production. May direct support personnel and/or partner organizations in the preparation of detailed design, design testing, prototype fabrication, and production tooling.


  • Designs engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling based on established engineering principles and in accordance with development technology practices and guidelines.

  • Develops and implements parameters and test plans for new and existing designs, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, developing fan curves, system power measurements & acoustics.

  • Collaborates and communicates with management, internal, and outsourced development partners regarding design status, project progress, and issue resolution

  • Leads a project team of other mechanical hardware engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for moderately-complex products.

  • Represents the mechanical/thermal team for all phases of larger and more-complex development projects.

  • Provides guidance and mentoring to less-experienced staff members.

  • HardwareThermal experience is highly preferred.

  • Manage and lead the ODM suppliers for hardward design and thermal simulation

  • 3D CAD tools and Simulation tools capability (Pro/Engineer, ANSYS,.....)

Education and Experience

  • Bachelor's or Master's degree in Mechanical Engineering

  • Minimum 4-6 years experience

Knowledge and Skills

  • Using ProEngineer or other 3D CAD software as a mechanical design tool.

  • Thermal background highly preferred

  • Strong analytical and problem solving skills.

  • Strong understanding and experience in electronics packaging.

  • Designing sheet metal and plastic parts and associated production tooling and processes

  • Using CFD and thermal mockups to validate thermal solution.

  • Excellent written and verbal communication skills; mastery in English and local language. Ability to effectively communicate product architectures, design proposals and negotiate options at management levels.

Job -


Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -


Relocation -


EEO Tagline -

HP Inc. is EEO F/M/Protected Veteran/ Individual with Disabilities.

Learn more about HP personal data

practices at Privacy Statement at http://www.hp.com/go/privacy , and

Personal Data Rights Notice at http://www8.hp.com/uk/en/privacy/privacy_notice.html (where

applicable). Accessibility at HP at http://www8.hp.com/us/en/hp-information/accessibility-aging/index.html

and Terms at http://www8.hp.com/us/en/terms-of-use.html